Order Texas Instruments TMS320F28335PGFA on Hxcy.IC. Confirm available stock and prices, check the product specifications for TMS320F28335PGFA,and place an order online.Contact Email:Fit0209@hxcyic.com

TMS320F28335PGFA is a device with 150MIPS, FPU, 512KB flash memory EMIF、 C2000 with 12 bit ADC ™  32-bit MCU chip



C2000 ™  Real time microcontrollers are optimized for processing, sensing, and driving, which can improve the closed-loop performance of real-time control applications such as industrial motor drivers, photovoltaic inverters and digital power supplies, electric vehicles and transportation, motor control, and induction and signal processing. The C2000 series includes advanced performance MCUs and entry-level performance MCUs.

TMS320F28335、TMS320F28334、TMS320F28333、TMS320F28332、TMS320F28235、TMS320F28234  The TMS320F28232 device is a highly integrated high-performance solution suitable for control applications with strict requirements.

In this document, the devices are abbreviated as F28335, F28334, F28333, F28332, F28235, F28234, and F28232, respectively. The F2833x device comparison and F2823x device comparison provide a summary of the characteristics of each device.

C2000 ™  The introductory guide to real-time control microcontrollers (MCUs) covers all aspects of C2000 device development, from hardware to supporting resources. In addition to the main reference documents, each section also provides relevant links and resources to help users further understand the relevant information.

To learn more about C2000 MCU, please visit C2000 ™  Real time control of MCU page.

High performance static CMOS technology
Up to 150MHz (6.67ns cycle time)
1.9V/1.8V Core, 3.3V I/O Design
High performance 32-bit CPU (TMS320C28x)
IEEE 754 Single Precision Floating Point Unit (FPU) (F2833x only)
16 × 16 and 32 × 32 MAC operations
16 × 16 dual MAC
Harvard Bus Architecture
Fast interrupt response and handling
Unified Memory Programming Model
Efficient code (using C/C++and assembly language)
6-channel DMA controller (for ADC, McBSP, ePWM, XINTF, and SARAM)
16 bit or 32-bit external interface (XINTF)
Address coverage exceeds 2M × 16
on-chip memory
F28335, F28333, F28235: 256K × 16 flash memory, 34K × 16 SARAM
F28334, F28234: 128K × 16 flash memory, 34K × 16 SARAM
F28332, F28232: 64K × 16 flash memory, 26K × 16 SARAM
1K × 16 OTP ROM
Boot ROM (8K × 16)
Has software startup mode (via SCI, SPI, CAN, I2C, McBSP, XINTF, and parallel I/O)
Standard mathematical table
Clock and system control
On-Chip Oscillator
Watchdog timer module
You can connect the GPO0 to GPO63 pin to one of the eight external kernel interrupts
Peripheral Interrupt Extension (PIE) block that supports all 58 peripheral interrupts
128 bit secure key/lock
Protect flash/OTP/RAM blocks
Prevent firmware reverse engineering
Enhanced control peripherals
Up to 18 PWM output
Up to 6 HRPWM outputs, MEP resolution up to 150ps
Up to 6 event capture inputs
Up to 2 orthogonal encoder interfaces
Up to 8 32-bit timers (6 for eCAP and 2 for eQEP)
Up to 9 16 bit timers (6 for ePWM, 3 for XINTCTR)
Three 32-bit CPU timers
Serial port peripherals
Up to 2 CAN modules
Up to 3 SCI (UART) modules
Up to 2 McBSP modules (configurable as SPI)
An SPI module
1 internal integrated circuit (I2C) bus
12 bit ADC, 16 channels
80ns conversion rate
2 × 8 channel input multiplexer
Two sample hold
Single/synchronous conversion
Internal or external benchmarks
Up to 88 individually programmable multiplexed GPIO pins with input filtering capabilities
Support JTAG boundary scan
IEEE Standard 1149.1-1990 Test Access Port and Boundary Scan Architecture
Advanced debugging features
Analysis and breakpoint functionality
Real time debugging with the help of hardware
Development support includes
ANSI C/C++compiler/assembler/connector
Code Composer Studio ™  IDE
DSP/BIOS ™  And SYS/BIOS
Digital motor control and digital power software library
Low power mode, saving energy consumption
Support idle, standby, and shutdown modes
Disable separate peripheral clock
Byte order: Small end byte order
Encapsulation options:
Lead free, environmentally friendly packaging
176 Solder Ball Plastic Ball Grid Array (BGA) [ZJZ]
179 solder ball MicroStar BGA ™  [ZHH]
179 solder ball new fine pitch ball grid array (nFBGA) [ZAY]
176 pin thin quad flat package (LQFP) [PGF]
176 pin heat enhanced thin square flat package (HLQFP) [PTP]
Temperature options:
A: -40 ° C to 85 ° C (PGF, ZHH, ZAY, ZJZ)
S: -40 ° C to 125 ° C (PTP, ZJZ)
Q: -40 ° C to 125 ° C (PTP, ZJZ) (certified by AEC Q100 for automotive applications)